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HANBit
HMF4M32M8VGL
Flash-ROM Module 16MByte (4Mx32Bit), 72Pin-SIMM, 3.3V Design Part No. HMF4M32M8VGL GENERAL DESCRIPTION
The HMF4M32M8VGL is a high-speed flash read only memory (FROM) module containing 4,194,304 words organized in a x32bit configuration. The module consists of eight 2M x 8bit FROM mounted on a 72 -pin, double -sided, FR4-printed circuit board. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine, which controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from 12.0V flash or EPROM devices. Four chip enable inputs, (/WE0, /WE1, /WE2, /WE3) are used to enable the module's 8 bits independently. Output enable (/OE) and write enable (/WE) can set the memory input and output. When FROM module is disable condition the module is becoming power standby mode, system designer can get low -power design. All module components may be powered from a singl e +3.3V DC power supply and all inputs and outputs are TTLcompatible.
PIN ASSIGNMENT FEATURES
PIN w Access time : 70, 80, 90, 120ns w High-density 16MByte design w High-reliability, low-power design w Single + 3.3V 0.3V power supply w Easy memory expansion w All inputs and outputs are TTLcompatible w FR4-PCB design w Low profile 72-pin SIMM w Minimum 1,000,000 write/erase cycle w Sectors erase architecture w Sector group protection w Temporary sector group unprotection 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Symbol Vss NC DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 Vcc DQ7 /WE0 /RY_BY DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 /WE1 NC DQ16 PIN 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 Symbol DQ17 DQ18 DQ19 DQ20 DQ21 Vcc DQ22 DQ23 /WE2 NC DQ24 DQ25 DQ26 DQ27 Vss DQ28 DQ29 DQ30 DQ31 /WE3 /BANKE1 /Reset A2 /OE PIN 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 Symbol /BANKE0 A3 A4 A5 A6 A7 A8 A9 A10 A11 Vcc A12 A13 A14 A15 A16 A17 A18 A19 A20 A0 A1 NC Vss
OPTIONS
w Timing 70ns access 80ns access 90ns access 120ns access w Packages 72-pin SIMM
MARKING
-70 -80 -90 -120
17 18 19 20 21 22 23 24
M
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FUNCTIONAL BLOCK DIAGRAM
HMF4M32M8VGL
DQ0 - DQ31 A0 - A20 /WE0
32 21 A0-20 DQ 0-7 /WE /OE /CE RY-BY /Reset DQ 0-7 /WE /OE /CE RY-BY /Reset
A0-20
DQ 0-7
U1
U5
A0-20 DQ 0-7 /WE1 /WE /OE /CE RY-BY /Reset
A0-20 DQ 0-7 /WE /OE /CE RY-BY /Reset
DQ 8-15
U2
U6
A0-20 DQ0-7 /WE2 /WE /OE /CE RY-BY /Reset
A0-20 DQ0-7 /WE /OE /CE RY-BY /Reset
DQ 16-23
U3
U7
A0-20 /WE3 /OE /BANK-E0 RY-/BY /Reset /WE /OE /CE RY-BY /Reset DQ0-7
A0-20 /WE /OE /CE RY-BY /Reset DQ0-7
DQ 24-31
U4
U8
/BANK-E1
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TRUTH TABLE
MODE STANDBY NOT SELECTED READ WRITE or ERASE NOTE: X means don't care /OE X H L X /CE H L L L /WE X H H L /RESET Vcc0.3V H H H
HMF4M32M8VGL
DQ ( /BYTE=L ) HIGH-Z HIGH-Z DOUT DIN
POWER STANDBY ACTIVE ACTIVE ACTIVE
ABSOLUTE MAXIMUM RATINGS
PARAMETER Voltage with respect to ground all other pins Voltage with respect to ground Vcc Power dissipation Storage Temperature SYMBOL VIN,OUT VCC PD TSTG RATING -0.5V to Vcc+0.5V -0.5V to +4.0V 8W -65oC to +150oC
Operating Temperature TA -55oC to +125 oC w Stresses greater than those listed under " Absolute Ma ximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operating section of this specification is not implied. Expo sure to absolute maximum rating conditions for extended periods may affect reliability.
RECOMMENDED DC OPERATING CONDITIONS
PARAMETER Vcc for 10% device Supply Voltages Ground SYMBOL Vcc VSS MIN 2.7V 0 0 TYP. MAX 3.6V 0
DC AND OPERATING CHARACTERISTICS ( 0oC TA 70 oC )
PARAMETER Input Load Current Output Leakage Current Output High Voltage Output Low Voltage Vcc Active Read Current (1) /OE = VIH, Vcc Active Write Current (2) Vcc Standby Current Low Vcc Lock-Out Voltage Notes: 1. The Icc current listed is typically less than 2mA/MHz, with /OE at V IH. 2. Icc active while embedded algorithm (program or erase) is in progress /CE = VIL, /OE=VIH /CE, /RESET=Vcc0.3V 1MHZ ICC2 ICC3 VLKO 2.3 TEST CONDITIONS Vcc=Vcc max, V IN= VSS to Vcc Vcc=Vcc max, V OUT= VSS to Vcc IOH = -2.0mA, Vcc = Vcc min IOL = 4.0mA, Vcc =Vcc min /CE = VIL, 5MHZ ICC1 16 160 32 240 40.0 2.5 mA A V SYMBOL IL1 IL0 VOH VOL 72 2.4 0.45 128 mA MIN MAX 1.0 1.0 UNIT A A V V
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3. Maximum Icc current specifications are tested with Vcc=Vcc max
HMF4M32M8VGL
ERASE AND PROGRAMMING PERFORMANCE
LIMITS PARAMETER MIN. Sector Erase Time Chip Erase Time Byte Programming Time Chip Programming Time TYP. 0.7 25 9 12 300 36 MAX. 15 sec sec s sec Excludes system-level overhead Excludes 00H programming prior to erasure UNIT COMMENTS
TSOP CAPACITANCE
PARAMETER SYMBOL CIN COUT CIN2 PARAMETER DESCRIPTION Input Capacitance Output Capacitance Control Pin Capacitance
o
TEST SETUP VIN = 0 VOUT = 0 VIN = 0
TYP. 6 8.5 7.5
MAX 7.5 12 9
UNIT pF pF pF
Notes : Test conditions TA = 25 C, f=1.0 MHz.
AC CHARACTERISTICS u Read Only Operations Characteristics
PARAMETER SYMBOLS DESCRIPTION JEDEC STANDARD tAVAV tAVQV tELQV tGLQV tEHQZ tGHQZ tAXQX tRC tACC tCE tOE tDF tDF tQH Read Cycle Time Address to Output Delay Chip Enable to Output Delay Output Enable to Output Delay Chip Enable to Output High-Z Output Enable to Output High-Z Output Hold Time From Addresses, /CE or /OE, Whichever Occurs First /CE = V IL /OE = VIL /OE = VIL Min Max Max Max Max Max Min TEST SETUP -70R 70 70 70 30 25 25 -80 80 80 80 30 25 25 0 -90 90 90 90 35 30 30 -120 120 120 120 50 30 30 ns ns ns ns ns ns ns Speed Options UNIT
TEST SPECIFICATIONS
TEST CONDITION Output load Output load capacitance,CL (Including jig capacitance) Input rise and fall times Input pulse levels
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70R, 80 1TTL gate 30 5 0.0-3.0
90, 120
UNIT
100
pF ns V
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Input timing measurement reference levels Output timing measurement reference levels
HMF4M32M8VGL
1.5 1.5 V V
5.0V
2.7k Device Under Test CL IN3064 or Equivalent
6.2k
Diodes = IN3064 or Equivalent
Note : CL = 100pF including jig capacitance
u Erase/Program Operations
PARAMETER SYMBOLS DESCRIPTION JEDEC tAVAV tAVWL tWLAX tDVWH tWHDX STANDARD tWC tAS tAH tDS tDH tOES tGHWL tELWL tWHEH tWLWH tWHWL tWHWH1 tWHWH2 tGHWL Write tCS tCH tWP tWPH tWHWH1 tWHWH2 tVCS /CE Setup Time /CE Hold Time Write Pulse Width Write Pulse Width High Byte Programming Operation Sector Erase Operation (Note1) Vcc set up time Min Min Min Min Typ Typ Min 35 35 30 9 0.7 50 0 0 35 50 ns ns ns ns s sec s Write Cycle Time Address Setup Time Address Hold Time Data Setup Time Data Hold Time Output Enable Setup Time Read Recovery Time Before Min Min Min Min Min Min Min 45 35 45 35 0 0 0 ns 70R 70 80 80 0 45 45 50 50 90 90 120 120 ns ns ns ns ns ns Speed Options UNIT
Notes : 1 . This does not include the preprogramming time 2 . This timing is only for Sector Protect operations
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u Erase/Program Operations Alternate /CE Controlled Writes
PARAMETER SYMBOLS DESCRIPTION JEDEC tAVAV tAVWL tWLAX tDVWH tWHDX STANDARD tWC tAS tAH tDS tDH tOES tGHWL tELWL tWHEH tWLWH tWHWL tWHWH1 tWHWH2 tGHWL tCS tCH tWP tWPH tWHWH1 tWHWH2 Write Cycle Time Address Setup Time Address Hold Time Data Setup Time Data Hold Time Output Enable Setup Time Read Recovery Time Before Write /CE Setup Time /CE Hold Time Write Pulse Width Write Pulse Width High Byte Programming Operation Sector Erase Operation (Note1) Min Min Min Min Min Min Min Min Min Min Min Typ Typ
HMF4M32M8VGL
Speed Options UNIT -70R 70 -80 80 0 45 35 45 35 0 0 0 0 0 35 35 30 9 0.7 35 50 45 45 50 50 -90 90 120 120 ns ns ns ns ns ns ns ns ns ns ns s sec
Notes : 1. This does not include the preprogramming time 2 . This timing is only for Sector Protect operations
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u READ OPERATIONS TIMING
HMF4M32M8VGL
u RESET TIMING
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u PROGRAM OPERATIONS TIMING
HMF4M32M8VGL
u CHIP/SECTOR ERASE OPERATION TIMINGS
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HMF4M32M8VGL
u DATA# POLLING TIMES(DURING EMBEDDED ALGORITHMS)
u TOGGLE# BIT TIMINGS (DURING EMBEDDED ALGORITHMS)
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u SECTOR PROTECT UNPROTECT TIMEING DIAGRAM
HMF4M32M8VGL
u ALTERNATE CE# CONTROLLED WRITE OPERATING TIMINGS
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PACKAGE DIMENSIONS
(UNIT : mm)
HMF4M32M8VGL
2.54 mm 0.25 mm MAX MIN
Gold: 1.040.10 mm 1.27 Solder: 0.9140.10 mm
1.270.08 mm
(Solder & Gold Plating)
ORDERING INFORMATION
Component Number 8EA 8EA 8EA 8EA
Part Number
Density
Org.
Package
Vcc
SPEED
HMF4M32M8VGL-70 HMF4M32M8VGL-80 HMF4M32M8VGL-90 HMF4M32M8VGL-120
16MByte 16MByte 16MByte 16MByte
4Mx 32bit 4Mx 32bit 4Mx 32bit 4Mx 32bit
72Pin -SIMM 72Pin -SIMM 72Pin -SIMM 72Pin -SIMM
3.3V 3.3V 3.3V 3.3V
70ns 80ns 90ns 120ns
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